Thin Film Glass Substrate Embossing Mold
Nanoprecision embossing mold for microstructuring thin glass substrates used in displays and sensors. Under HTS 8480.50.00.90 for specialized glass molds, excluding semiconductor wafer processing equipment per statistical notes.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | +35.0% | 35% |
| 🇲🇽Mexico | Free | +10.0% | 10% |
| 🇨🇦Canada | Free | +10.0% | 10% |
| 🇩🇪Germany | Free | +10.0% | 10% |
| 🇯🇵Japan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for semiconductor wafer molding
Semiconductor machines in 8486 per statistical notes, not general glass.
If for polymer display substrates
Plastic embossing molds under 8480.79 material heading.
If for optical sensor glass testing
Testing apparatus for glass devices may go to Chapter 90.
Not sure which classification is right?
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Import Tips & Compliance
• Explicitly state non-semiconductor use in invoices to avoid Chapter 84/90 shifts
• Provide micron-level tolerance specs for customs verification
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