Thin Film Glass Substrate Embossing Mold from Japan
Nanoprecision embossing mold for microstructuring thin glass substrates used in displays and sensors. Under HTS 8480.50.00.90 for specialized glass molds, excluding semiconductor wafer processing equipment per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Explicitly state non-semiconductor use in invoices to avoid Chapter 84/90 shifts
• Provide micron-level tolerance specs for customs verification