Thin Film Glass Substrate Embossing Mold from Germany
Nanoprecision embossing mold for microstructuring thin glass substrates used in displays and sensors. Under HTS 8480.50.00.90 for specialized glass molds, excluding semiconductor wafer processing equipment per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Explicitly state non-semiconductor use in invoices to avoid Chapter 84/90 shifts
• Provide micron-level tolerance specs for customs verification