Wafer Slicing Diamond Saw

High-precision diamond wire saw that slices monocrystalline semiconductor boules into thin wafers for fabrication into electronic lamps, tubes, or flashbulbs housed in glass envelopes. Classified in HTS 8475.10.00.00 for its role in the assembly chain of glass-enclosed semiconductor devices.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8461.50Lower: 14.4% vs 35%

If configured for sawing semiconductor wafers directly

Wafer sawing machines classify under Chapter 84 sawing machinery if not boule-specific for lamps.

8479.89.65.00Lower: 20.3% vs 35%

If other semiconductor wafer prep equipment

Statistical notes direct slicing saws for wafers (not boule-to-wafer) to separate provisions.

8202.39.00Same rate: 35%

If sold as saw blades/parts only

Individual cutting tools classify in Chapter 82, not complete assembly machines.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide boule-to-wafer process documentation proving integration into lamp glass envelope assembly

Use HS explanatory notes on semiconductor statistical provisions for binding rulings