Wafer Slicing Diamond Saw from China
High-precision diamond wire saw that slices monocrystalline semiconductor boules into thin wafers for fabrication into electronic lamps, tubes, or flashbulbs housed in glass envelopes. Classified in HTS 8475.10.00.00 for its role in the assembly chain of glass-enclosed semiconductor devices.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide boule-to-wafer process documentation proving integration into lamp glass envelope assembly
• Use HS explanatory notes on semiconductor statistical provisions for binding rulings