Wafer Slicing Diamond Saw from Germany
High-precision diamond wire saw that slices monocrystalline semiconductor boules into thin wafers for fabrication into electronic lamps, tubes, or flashbulbs housed in glass envelopes. Classified in HTS 8475.10.00.00 for its role in the assembly chain of glass-enclosed semiconductor devices.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide boule-to-wafer process documentation proving integration into lamp glass envelope assembly
• Use HS explanatory notes on semiconductor statistical provisions for binding rulings