Semiconductor Wafer Lapper
Machine that laps semiconductor wafers to precise thickness and flatness tolerances, preparing surfaces for deposition processes in glass-enclosed electronic tubes and lamps. Falls under HTS 8475.10.00.00 as essential equipment in the assembly of devices within glass envelopes.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If lapping non-semiconductor glass or metal parts
General lapping machines without semiconductor/lamp specificity classify elsewhere in Chapter 84.
If for optical glass compound preparation
Microscope-related lappers fall in Chapter 90, not electronic lamp assembly.
If dedicated semiconductor wafer lapping line
Full semiconductor processing suites have specific statistical provisions.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Include flatness specification sheets (e.g
• <1 micron) linking to glass envelope device requirements
• Declare as 'lamp assembly preparation equipment' to align with heading description
Related Products under HTS 8475.10.00.00
Electronic Tube Sealing Machine
Precision equipment that fuses glass envelopes around vacuum tube electrodes and semiconductor elements under controlled atmospheres. HTS 8475.10.00.00 specifically covers such assembly machines for electronic tubes in glass envelopes.
Lamp Lead Wire Sealing Machine
Machine that seals lead wires through glass envelopes while maintaining vacuum integrity for electric lamps and tubes. Critical assembly step covered by HTS 8475.10.00.00 for glass envelope lamp assembly.
Getter Flash Assembly Unit
Equipment that installs and activates getter materials inside glass envelopes to maintain vacuum in electronic tubes and lamps. Part of the complete assembly process under HTS 8475.10.00.00.
Base Attachment Machine for Lamps
Automated machine that cements or crimps lamp bases onto sealed glass envelopes containing electronic filaments. Final assembly step for complete lamps under HTS 8475.10.00.00.
Tube Cathode Assembly Station
Workstation that assembles cathodes and grids inside glass envelopes before final sealing for electronic tubes. HTS 8475.10.00.00 covers all stages of tube assembly in glass envelopes.
LED Lamp Glass Envelope Sealer
Modern machine that hermetically seals LED chips within glass envelopes for high-reliability lamps and indicator lights. Still classified under HTS 8475.10.00.00 for assembly of electric lamps in glass envelopes.