Semiconductor Wafer Lapper from Germany
Machine that laps semiconductor wafers to precise thickness and flatness tolerances, preparing surfaces for deposition processes in glass-enclosed electronic tubes and lamps. Falls under HTS 8475.10.00.00 as essential equipment in the assembly of devices within glass envelopes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include flatness specification sheets (e.g
• <1 micron) linking to glass envelope device requirements
• Declare as 'lamp assembly preparation equipment' to align with heading description