Semiconductor Wafer Lapper from Japan
Machine that laps semiconductor wafers to precise thickness and flatness tolerances, preparing surfaces for deposition processes in glass-enclosed electronic tubes and lamps. Falls under HTS 8475.10.00.00 as essential equipment in the assembly of devices within glass envelopes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include flatness specification sheets (e.g
• <1 micron) linking to glass envelope device requirements
• Declare as 'lamp assembly preparation equipment' to align with heading description