Diamond Wafer Grinding Machine from Canada
High-precision grinder using diamond abrasives for initial silicon wafer backgrinding. HTS 8474.20.00 applies to grinding machines processing semiconductor mineral wafers. Reduces wafer thickness from 700μm to <100μm for advanced packaging.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify diamond abrasive type and wafer thickness capabilities in import declarations
• Provide evidence of solid-form mineral processing to distinguish from liquid slurries
• Ensure machine calibration certificates for precision claims