Diamond Wafer Grinding Machine
High-precision grinder using diamond abrasives for initial silicon wafer backgrinding. HTS 8474.20.00 applies to grinding machines processing semiconductor mineral wafers. Reduces wafer thickness from 700μm to <100μm for advanced packaging.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If handheld or small-scale grinding tools
Smaller grinding machines for semiconductor materials may fall under Chapter 84 honing/grinding tools.
If with integrated optical inspection
Grinding machines with primary optical measuring function shift to Chapter 90.
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Import Tips & Compliance
• Specify diamond abrasive type and wafer thickness capabilities in import declarations
• Provide evidence of solid-form mineral processing to distinguish from liquid slurries
• Ensure machine calibration certificates for precision claims
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