Crushing or grinding machines
Machinery for sorting, screening, separating, washing, crushing, grinding, mixing or kneading earth, stone, ores or other mineral substances, in solid (including powder or paste) form; machinery for agglomerating, shaping or molding solid mineral fuels, ceramic paste, unhardened cements, plastering materials or other mineral products in powder or paste form; machines for forming foundry molds of sand; parts thereof: > Crushing or grinding machines
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8474.20.00
Czochralski Crystal Puller Grinder
A precision grinding machine used to grind semiconductor crystal boules produced by Czochralski method to exact diameters for wafer slicing. It falls under HTS 8474.20.00 as a grinding machine for mineral substances like silicon crystals in solid form. Essential for semiconductor manufacturing to ensure conductivity and resistivity specifications.
Float Zone Crystal Boule Grinder
Grinding apparatus for float zone monocrystalline semiconductor boules, creating precise flats indicating resistivity. Classified in HTS 8474.20.00 for grinding solid mineral substances in semiconductor production. Prepares crystals for wafer slicing by achieving dimensional accuracy.
Silicon Wafer Preparation Lapper
Lapping machine that grinds silicon wafers to tight flatness tolerances before fabrication processing. HTS 8474.20.00 covers this as grinding equipment for semiconductor mineral wafers in solid form. Critical for achieving surface planarity in chip manufacturing.
Gallium Arsenide Crystal Grinder
Specialized grinder for GaAs compound semiconductor boules, grinding to precise diameters and flats. Falls under HTS 8474.20.00 as crushing/grinding machinery for mineral substances in solid form. Used in optoelectronics and high-frequency device production.
Diamond Wafer Grinding Machine
High-precision grinder using diamond abrasives for initial silicon wafer backgrinding. HTS 8474.20.00 applies to grinding machines processing semiconductor mineral wafers. Reduces wafer thickness from 700μm to <100μm for advanced packaging.
boule Crystal Diameter Grinder
Automated grinder that shapes semiconductor boules to uniform diameter specifications for consistent wafer yield. Classified HTS 8474.20.00 for grinding solid mineral substances like silicon crystals. Includes flats grinding for doping orientation.
Semiconductor Wafer Edge Grinder
Edge grinding machine that chamfers and shapes wafer peripheries to prevent chipping during handling. HTS 8474.20.00 for grinding semiconductor wafers as solid mineral products. Improves wafer strength and handling in fabs.
Crystal Ingot Slicing Pre-Grinder
Pre-grinding machine preparing silicon ingots before multi-wire saw slicing into wafers. Falls under HTS 8474.20.00 as grinding equipment for solid semiconductor minerals. Ensures uniform slicing and higher wafer quality.