Wafer Crystal Grinder

Precision grinder for shaping semiconductor crystal boules to exact diameter before wafer slicing, as per statistical notes. While grinding, classified under HTS 8474.10.00 if part of sorting/screening prep per notes.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

More Specific Codes

This product may fall under a more specific subheading:

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.40Lower: 14.4% vs 35%

If general precision grinding machines

Non-mineral or non-semiconductor grinders under 8460.

8481.80.90Higher: 37% vs 35%

If semiconductor fab equipment

Other semiconductor processing if post-wafer.

8479.89Lower: 12.5% vs 35%

If other semiconductor machines

If not fitting sorting notes precisely.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Reference statistical note (a)(ii)(A) in docs

Cleanroom compatibility certs

Not Chapter 90 testing