Wafer Crystal Grinder from China

Precision grinder for shaping semiconductor crystal boules to exact diameter before wafer slicing, as per statistical notes. While grinding, classified under HTS 8474.10.00 if part of sorting/screening prep per notes.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Reference statistical note (a)(ii)(A) in docs

• Cleanroom compatibility certs

• Not Chapter 90 testing