Wafer Crystal Grinder from Japan

Precision grinder for shaping semiconductor crystal boules to exact diameter before wafer slicing, as per statistical notes. While grinding, classified under HTS 8474.10.00 if part of sorting/screening prep per notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Reference statistical note (a)(ii)(A) in docs

• Cleanroom compatibility certs

• Not Chapter 90 testing