Wafer Crystal Grinder from Japan
Precision grinder for shaping semiconductor crystal boules to exact diameter before wafer slicing, as per statistical notes. While grinding, classified under HTS 8474.10.00 if part of sorting/screening prep per notes.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Reference statistical note (a)(ii)(A) in docs
• Cleanroom compatibility certs
• Not Chapter 90 testing