Wafer Lapping Plate from Mexico
Cast iron or ceramic lapping plate for simultaneous double-side lapping of semiconductor wafers to achieve total thickness variation (TTV) tolerances, specific to 8472.90.50 lappers. Provides uniform material removal for flatness. HTS 8473.40.41.00 classification.
Duty Rate — Mexico → United States
12%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify plate flatness specs (<1μm) and conditioning slurry compatibility
• Provide evidence of use in double-side lapping vs single-side grinding
• Watch for reclassification if plate size fits general precision lapping machines