Wafer Lapping Plate from Canada
Cast iron or ceramic lapping plate for simultaneous double-side lapping of semiconductor wafers to achieve total thickness variation (TTV) tolerances, specific to 8472.90.50 lappers. Provides uniform material removal for flatness. HTS 8473.40.41.00 classification.
Duty Rate — Canada → United States
12%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify plate flatness specs (<1μm) and conditioning slurry compatibility
• Provide evidence of use in double-side lapping vs single-side grinding
• Watch for reclassification if plate size fits general precision lapping machines