Czochralski Crystal Puller Furnace from China
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules from which semiconductor wafers are sliced. It is a key piece of wafer manufacturing equipment classified under HTS 8473.30.91.00 as a part suitable solely for machines of heading 8471 used in semiconductor processing.
Duty Rate — China → United States
50%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Verify equipment is dedicated to semiconductor wafer production with manufacturer specs; obtain end-user certificates for cleanroom compatibility; watch for ITAR restrictions on high-tech components