Other
Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472: > Parts and accessories of the machines of heading 8471: > Other
Duty Rate (from China)
Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 8473.30.91.00
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules from which semiconductor wafers are sliced. It is a key piece of wafer manufacturing equipment classified under HTS 8473.30.91.00 as a part suitable solely for machines of heading 8471 used in semiconductor processing.
Float Zone Crystal Grower
Apparatus employing the float zone method to produce ultra-pure monocrystalline semiconductor boules without crucibles. Designed exclusively for semiconductor material growth, fitting HTS 8473.30.91.00 as an accessory for 8471 machines.
Semiconductor Crystal Grinder
Precision grinder for shaping crystal boules to exact diameters and flats indicating conductivity and resistivity, per statistical note (a)(ii)(A). Classified in HTS 8473.30.91.00 as a part for 8471 semiconductor machines.
Wafer Slicing Diamond Saw
High-precision diamond wire or blade saw for slicing thin wafers from monocrystalline semiconductor boules, as noted in statistical note (a)(ii)(B). A dedicated accessory for 8471 machines under HTS 8473.30.91.00.
Semiconductor Wafer Lapper
Machine that laps semiconductor wafers to precise flatness and thickness tolerances before polishing, aligning with statistical note (a)(ii)(C). Parts for 8471 heading machines under HTS 8473.30.91.00.
Wafer Edge Grinder
Specialized grinder for chamfering and profiling wafer edges to prevent chipping during handling and processing. Essential wafer preparation equipment classified under HTS 8473.30.91.00 for 8471 machines.
Double-Sided Wafer Polisher
Polishing machine that simultaneously processes both sides of semiconductor wafers to mirror finish and precise flatness, per statistical note. Accessory for heading 8471 under HTS 8473.30.91.00.
Crystal Boule Inspection Station
Automated station for measuring boule diameter, flat positions, and resistivity post-grinding, integral to semiconductor wafer prep workflow. Fits HTS 8473.30.91.00 as 8471 parts.
Wafer Thickness Mapping System
System mapping wafer thickness uniformity across surface for quality control in preparation process. Accessory principally for 8471 semiconductor machines in HTS 8473.30.91.00.
Diamond Slurry Dispenser for Wafer Prep
Precision dispenser for colloidal diamond slurry used in wafer grinding/lapping/polishing operations. Specialized accessory for 8471 machines under HTS 8473.30.91.00.
SEMI Wafer Handling Cassette Loader
Automated loader transferring FOUP/FOF cassettes to wafer processing equipment in cleanroom environment. Parts suitable solely for 8471 semiconductor machines per HTS 8473.30.91.00.