3DS Stacked 16GB HBM2 Memory Module
16GB High Bandwidth Memory 2 (HBM2) module using 3D stacking technology for AI accelerators and high-performance 8471 workstations. The advanced printed circuit assembly provides massive bandwidth for compute-intensive applications. Classifies under 8473.30.11.40 when principally for data processing computers.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If mounted on graphics processing accelerators
HBM principally for GPUs classifies as display adapter assemblies.
If HBM DRAM stacks without system PCB
Advanced semiconductor packages classify as ICs if not full modules.
If integral to shipped AI server systems
Pre-installed high-performance memory travels with complete units.
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Import Tips & Compliance
• Provide interposer and TSV (through-silicon via) technical diagrams for complex structures
• Distinguish from GPU VRAM via system architecture documentation
• High-value tech; consider bonded warehouse for duty deferral
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DDR5 16GB Desktop DIMM RAM Module
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LPDDR4X 4GB Mobile SoC RAM Module
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