3DS Stacked 16GB HBM2 Memory Module from Mexico
16GB High Bandwidth Memory 2 (HBM2) module using 3D stacking technology for AI accelerators and high-performance 8471 workstations. The advanced printed circuit assembly provides massive bandwidth for compute-intensive applications. Classifies under 8473.30.11.40 when principally for data processing computers.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide interposer and TSV (through-silicon via) technical diagrams for complex structures
• Distinguish from GPU VRAM via system architecture documentation
• High-value tech; consider bonded warehouse for duty deferral