3DS Stacked 16GB HBM2 Memory Module from China
16GB High Bandwidth Memory 2 (HBM2) module using 3D stacking technology for AI accelerators and high-performance 8471 workstations. The advanced printed circuit assembly provides massive bandwidth for compute-intensive applications. Classifies under 8473.30.11.40 when principally for data processing computers.
Duty Rate — China → United States
50%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide interposer and TSV (through-silicon via) technical diagrams for complex structures
• Distinguish from GPU VRAM via system architecture documentation
• High-value tech; consider bonded warehouse for duty deferral