Wafer Thickness Measurement Gauge from Japan
In-line metrology tool that precisely measures semiconductor wafer thickness during grinding/lapping operations. Classified HTS 8471.90.00.00 as semiconductor processing control equipment.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide measurement accuracy, repeatability, and integration specifications
• Include capacitive/optical sensing technology documentation
• Distinguish from general gauges with semiconductor thin-film requirements