Wafer Grinder Coolant Manifold
Precision coolant distribution manifold for back grinding machines that thin semiconductor wafers to final target thickness. Classified under HTS 8466.93.98.85 as an accessory ensuring thermal stability during semiconductor wafer processing equipment operation. Features micron-level nozzle positioning.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If functioning primarily as water filtration machinery
Machinery for filtering water, even for industrial use, has specific provisions.
If imported as simple pipe fitting without semiconductor specifications
Basic stainless steel tube/pipe fittings classify under Chapter 73.
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Import Tips & Compliance
• Specify coolant flow rates and pressure differentials; include nozzle pattern diagrams; document compatibility with deionized water systems
Related Products under HTS 8466.93.98.85
Czochralski Crystal Puller Control Module
Electronic control module specifically designed for regulating temperature and rotation in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. This part falls under HTS 8466.93.98.85 as a specialized accessory for semiconductor manufacturing machines in heading 8461. It ensures precise control over crystal growth parameters critical for semiconductor production.
Semiconductor Wafer Slicing Saw Spindle Assembly
Precision spindle assembly for inner diameter wafer slicing saws used to cut ultra-thin silicon wafers from monocrystalline boules in semiconductor fabrication. Classified under HTS 8466.93.98.85 as a key component for machines of heading 8461 dedicated to semiconductor wafer preparation. Features diamond-impregnated blade mounting for sub-micron accuracy.
Float Zone Crystal Grinder Chuck
Vacuum chuck assembly for float zone crystal grinders that shape semiconductor boules to precise wafer diameters while maintaining flat orientation indicators. This accessory for heading 8461 machines is classified in HTS 8466.93.98.85 due to its specialized use in semiconductor material processing. Ensures conductivity type markings remain accurate during grinding.
Wafer Lapping Machine Work Holder
Specialized work holder for double-sided lapping machines that simultaneously lap both surfaces of semiconductor wafers to achieve nanometer flatness. Falls under HTS 8466.93.98.85 as an accessory for semiconductor wafer preparation equipment of heading 8461. Features pin-plate carrier system for uniform pressure distribution.
Silicon Boule Grinder Flattening Fixture
Precision fixture for grinding flats on silicon boules to indicate crystal orientation and resistivity type for subsequent wafer slicing. Classified under HTS 8466.93.98.85 as a special attachment for semiconductor crystal processing machines of heading 8461. Ensures repeatable flat positioning critical for wafer fabrication.
Diamond Wafer Polishing Head Assembly
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