Wafer Grinder Coolant Manifold from Canada
Precision coolant distribution manifold for back grinding machines that thin semiconductor wafers to final target thickness. Classified under HTS 8466.93.98.85 as an accessory ensuring thermal stability during semiconductor wafer processing equipment operation. Features micron-level nozzle positioning.
Duty Rate — Canada → United States
14.7%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify coolant flow rates and pressure differentials; include nozzle pattern diagrams; document compatibility with deionized water systems