Wafer Grinder Coolant Manifold from Japan
Precision coolant distribution manifold for back grinding machines that thin semiconductor wafers to final target thickness. Classified under HTS 8466.93.98.85 as an accessory ensuring thermal stability during semiconductor wafer processing equipment operation. Features micron-level nozzle positioning.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify coolant flow rates and pressure differentials; include nozzle pattern diagrams; document compatibility with deionized water systems