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8466.93.98.85/Wafer Grinder Coolant Manifold/Japan

Wafer Grinder Coolant Manifold from Japan

Precision coolant distribution manifold for back grinding machines that thin semiconductor wafers to final target thickness. Classified under HTS 8466.93.98.85 as an accessory ensuring thermal stability during semiconductor wafer processing equipment operation. Features micron-level nozzle positioning.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify coolant flow rates and pressure differentials; include nozzle pattern diagrams; document compatibility with deionized water systems

Wafer Grinder Coolant Manifold from Japan — Import Duty Rate | HTS 8466.93.98.85