Crystal Boule Grinder Spindle Assembly from Japan
High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Dedicated component for 8456.11 machine tools used principally in semiconductor wafer preparation for printed circuit manufacturing. Features vibration-dampening and hydrostatic bearings for sub-micron accuracy.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include technical drawings showing semiconductor-specific tolerances; obtain supplier certification of principal use; watch for anti-dumping duties on precision bearings