Crystal Boule Grinder Spindle Assembly
High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Dedicated component for 8456.11 machine tools used principally in semiconductor wafer preparation for printed circuit manufacturing. Features vibration-dampening and hydrostatic bearings for sub-micron accuracy.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general flywheels or pulleys
Plain bearing assemblies without semiconductor-specific tolerances classify as general machinery parts
If for non-semiconductor machine tools
Same parts for general 8456-8461 tools without printed circuit/ADP specificity fall in other subheadings
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Import Tips & Compliance
• Include technical drawings showing semiconductor-specific tolerances; obtain supplier certification of principal use; watch for anti-dumping duties on precision bearings
Related Products under HTS 8466.93.96.00
Wafer Slicing Diamond Saw Blade
Precision diamond-impregnated saw blade designed for wafer slicing saws used to cut monocrystalline semiconductor boules into thin wafers. Specifically engineered for machine tools in subheading 8456.12, suitable solely for printed circuit and semiconductor manufacturing equipment. Its ultra-fine grit and tension control ensure damage-free wafer separation critical for subsequent fabrication processes.
Wafer Lapping Plate
Cast iron or copper lapping plate used in wafer grinders/lappers to achieve flatness tolerances under 1 micron for semiconductor wafers prior to fabrication. Surface-engineered for 8456.30 machine tools dedicated to printed circuit manufacturing processes. Maintains parallelism critical for subsequent photolithography alignment.
PCB Drilling Machine Spindle
Air-bearing spindle for high-speed PCB drilling machines (8458.91) achieving 200,000+ RPM for microvia formation in printed circuit boards. Dedicated part principally used for printed circuit assembly manufacturing with dynamic balancing for 24/7 production.
Wafer Polishing Head Assembly
Multi-head polishing assembly for wafer polishers that achieve mirror finish on semiconductor wafers for device fabrication. Precision kinematic mounts ensure uniform pressure distribution across 300mm wafers in 8456.30 machines dedicated to printed circuit manufacturing.
Crystal Puller Crucible Holder
Graphite crucible holder for Czochralski crystal pullers (8456.11) that precisely positions iridium crucibles during monocrystalline silicon boule growth. Temperature-resistant to 1600°C with rotation drive for CZ process uniformity in semiconductor wafer production.
Float Zone Crystal Rotation Shaft
RF induction compatible rotation shaft for float zone crystal growers producing ultra-pure silicon ingots for power semiconductor wafers. Precision bearings and balance for 8456.11 machine tools used solely in printed circuit manufacturing processes.