Parts and accessories of machine tools of subheadings 8456.11, 8456.12, 8456.30, 8457.10, 8458.91, 8459.21, 8459.61 and 8461.50, of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 8517 or parts of automatic data processing machines
Parts and accessories suitable for use solely or principally with the machines of headings 8456 to 8465, including work or tool holders, self-opening dieheads, dividing heads and other special attachments for the machines; tool holders for any type of tool for working in the hand: > Other: > For machines of headings 8456 to 8461: > Other: > Other: > Other: > Other: > Parts and accessories of machine tools of subheadings 8456.11, 8456.12, 8456.30, 8457.10, 8458.91, 8459.21, 8459.61 and 8461.50, of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 8517 or parts of automatic data processing machines
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8466.93.96.00
Wafer Slicing Diamond Saw Blade
Precision diamond-impregnated saw blade designed for wafer slicing saws used to cut monocrystalline semiconductor boules into thin wafers. Specifically engineered for machine tools in subheading 8456.12, suitable solely for printed circuit and semiconductor manufacturing equipment. Its ultra-fine grit and tension control ensure damage-free wafer separation critical for subsequent fabrication processes.
Crystal Boule Grinder Spindle Assembly
High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Dedicated component for 8456.11 machine tools used principally in semiconductor wafer preparation for printed circuit manufacturing. Features vibration-dampening and hydrostatic bearings for sub-micron accuracy.
Wafer Lapping Plate
Cast iron or copper lapping plate used in wafer grinders/lappers to achieve flatness tolerances under 1 micron for semiconductor wafers prior to fabrication. Surface-engineered for 8456.30 machine tools dedicated to printed circuit manufacturing processes. Maintains parallelism critical for subsequent photolithography alignment.
PCB Drilling Machine Spindle
Air-bearing spindle for high-speed PCB drilling machines (8458.91) achieving 200,000+ RPM for microvia formation in printed circuit boards. Dedicated part principally used for printed circuit assembly manufacturing with dynamic balancing for 24/7 production.
Wafer Polishing Head Assembly
Multi-head polishing assembly for wafer polishers that achieve mirror finish on semiconductor wafers for device fabrication. Precision kinematic mounts ensure uniform pressure distribution across 300mm wafers in 8456.30 machines dedicated to printed circuit manufacturing.
Crystal Puller Crucible Holder
Graphite crucible holder for Czochralski crystal pullers (8456.11) that precisely positions iridium crucibles during monocrystalline silicon boule growth. Temperature-resistant to 1600°C with rotation drive for CZ process uniformity in semiconductor wafer production.
Float Zone Crystal Rotation Shaft
RF induction compatible rotation shaft for float zone crystal growers producing ultra-pure silicon ingots for power semiconductor wafers. Precision bearings and balance for 8456.11 machine tools used solely in printed circuit manufacturing processes.
PCB Router Tool Changer
Automatic tool changer magazine for PCB routing machines (8458.91) holding carbide micro-endmills for depaneling high-density circuit boards. Quick-change system optimized for printed circuit assembly production with dust extraction integration.
Wafer Grinder Workholding Chuck
Vacuum/porous ceramic chuck for securing semiconductor wafers during grinding operations in 8456.30 precision machines. Maintains wafer flatness during thickness reduction for printed circuit fabrication processes.
Seed Crystal Holder Clip
Tungsten clip assembly for precisely holding seed crystals during Czochralski pulling in silicon wafer production equipment. Thermal shock resistant design for 1450°C process temperatures in 8456.11 crystal growers.