Float Zone Crystal Grower Dividing Head

A precision dividing head attachment for float zone crystal growing machines, used to rotate and position semiconductor boules during monocrystalline growth. Classified under HTS 8466.30.60.85 for special attachments on semiconductor processing equipment of headings 8456-8465.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2.9%+35.0%37.9%
🇲🇽Mexico2.9%+10.0%12.9%
🇨🇦Canada2.9%+10.0%12.9%
🇩🇪Germany2.9%+10.0%12.9%
🇯🇵Japan2.9%+10.0%12.9%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8466.94.85Higher: 39.7% vs 37.9%

If

8479.89.65.00Lower: 20.3% vs 37.9%

If

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Import Tips & Compliance

Provide end-use certificates linking to wafer manufacturing statistical notes for duty preferences

Ensure labeling specifies 'for semiconductor crystal growers only' to prevent reclassification

Related Products under HTS 8466.30.60.85

Czochralski Crystal Puller Attachment Kit

This specialized attachment kit is designed for use with crystal growing machines in semiconductor wafer manufacturing, enabling the Czochralski method to produce monocrystalline silicon boules. It falls under HTS 8466.30.60.85 as a special attachment for machines of heading 8461 used in semiconductor processing.

Semiconductor Wafer Slicing Saw Tool Holder

Special tool holder attachment for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It qualifies for HTS 8466.30.60.85 as a special attachment for machines in wafer preparation under statistical note (b)(ii)(B).

Semiconductor Wafer Polisher Dividing Head

Rotary dividing head for wafer polishers that achieve mirror-finish surfaces on semiconductor wafers prior to device fabrication. Classified in HTS 8466.30.60.85 for special attachments on polishing machines per statistical notes.

Wafer Grinder Flange Holder

Custom flange holder attachment securing wafers during back-grinding to target thickness in semiconductor prep. Falls under HTS 8466.30.60.85 for grinder special attachments in statistical note (b)(ii)(C).

Boule Diameter Grinder Indexing Head

Indexing head attachment for grinders that achieve precise boule diameters for standard wafer sizes (e.g., 300mm). Classified HTS 8466.30.60.85 per wafer prep statistical provisions.

Crystal Puller Rotation Drive Attachment

Motorized rotation drive special attachment for Czochralski pullers maintaining uniform crystal growth doping. HTS 8466.30.60.85 for dividing/other attachments on semiconductor crystal growers.