Other
Parts and accessories suitable for use solely or principally with the machines of headings 8456 to 8465, including work or tool holders, self-opening dieheads, dividing heads and other special attachments for the machines; tool holders for any type of tool for working in the hand: > Dividing heads and other special attachments for machines: > Other special attachments > Machines > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8466.30.60.85
Czochralski Crystal Puller Attachment Kit
This specialized attachment kit is designed for use with crystal growing machines in semiconductor wafer manufacturing, enabling the Czochralski method to produce monocrystalline silicon boules. It falls under HTS 8466.30.60.85 as a special attachment for machines of heading 8461 used in semiconductor processing.
Semiconductor Wafer Slicing Saw Tool Holder
Special tool holder attachment for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It qualifies for HTS 8466.30.60.85 as a special attachment for machines in wafer preparation under statistical note (b)(ii)(B).
Semiconductor Wafer Polisher Dividing Head
Rotary dividing head for wafer polishers that achieve mirror-finish surfaces on semiconductor wafers prior to device fabrication. Classified in HTS 8466.30.60.85 for special attachments on polishing machines per statistical notes.
Wafer Grinder Flange Holder
Custom flange holder attachment securing wafers during back-grinding to target thickness in semiconductor prep. Falls under HTS 8466.30.60.85 for grinder special attachments in statistical note (b)(ii)(C).
Boule Diameter Grinder Indexing Head
Indexing head attachment for grinders that achieve precise boule diameters for standard wafer sizes (e.g., 300mm). Classified HTS 8466.30.60.85 per wafer prep statistical provisions.
Crystal Puller Rotation Drive Attachment
Motorized rotation drive special attachment for Czochralski pullers maintaining uniform crystal growth doping. HTS 8466.30.60.85 for dividing/other attachments on semiconductor crystal growers.
Float Zone Crystal Grower Dividing Head
A precision dividing head attachment for float zone crystal growing machines, used to rotate and position semiconductor boules during monocrystalline growth. Classified under HTS 8466.30.60.85 for special attachments on semiconductor processing equipment of headings 8456-8465.
Crystal Boule Grinder Work Holder
A self-centering work holder attachment for crystal grinders that shape semiconductor boules to precise diameters and flats indicating conductivity. Under HTS 8466.30.60.85 per statistical note (b)(ii)(A) for wafer preparation equipment.
Wafer Lapping Machine Special Attachment
Precision attachment for wafer lappers ensuring flatness tolerances during semiconductor wafer preparation for fabrication. Fits HTS 8466.30.60.85 as other special attachments for statistical note (b)(ii)(C) equipment.
Monocrystalline Boule Slicer Arbor Attachment
Arbor attachment for high-precision slicing saws converting semiconductor boules into wafers with minimal kerf loss. HTS 8466.30.60.85 applies as special attachment for wafer manufacturing equipment.