Machines
Parts and accessories suitable for use solely or principally with the machines of headings 8456 to 8465, including work or tool holders, self-opening dieheads, dividing heads and other special attachments for the machines; tool holders for any type of tool for working in the hand: > Dividing heads and other special attachments for machines: > Other special attachments > Machines
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8466.30.60
Wafer Slicing Diamond Saw
High-precision inner-diameter saw with diamond blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. HTS 8466.30.60 covers it as a special attachment dedicated to semiconductor wafer manufacturing equipment.
Crystal Orientation Dividing Head
Rotary dividing head that precisely orients semiconductor crystals during grinding to expose specific crystallographic planes. Specifically provided for in HTS 8466.30 as dividing head for semiconductor machines.
Gallium Arsenide Wafer Slicer
Specialized slicing machine optimized for brittle GaAs compound semiconductor boules, featuring lower feed rates and coolant systems. Classified under HTS 8466.30.60 for compound semiconductor processing.
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It is classified under HTS 8466.30.60 as a special attachment for semiconductor manufacturing machines in headings 8456-8465, specifically for crystal growth in wafer production.
Float Zone Crystal Grower
Specialized apparatus employing the float zone method to purify and grow monocrystalline semiconductor boules without a crucible. Falls under HTS 8466.30.60 as other special attachments for machines used principally in semiconductor wafer preparation.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds orientation flats indicating conductivity type. Classified in HTS 8466.30.60 as a special attachment for wafer preparation machines under headings 8456-8465.
Semiconductor Wafer Lapper
Machine that laps both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness for subsequent processing. As a special attachment for wafer prep machines, it falls under HTS 8466.30.60.
Single-Side Wafer Polisher
Precision polisher that creates mirror-finish on one side of semiconductor wafers for device fabrication processes. Classified as other special attachment under HTS 8466.30.60 for use with wafer grinding machines.
Wafer Edge Profiling Attachment
Specialized tool that profiles wafer edges to prevent chipping and contamination during handling in semiconductor fabs. HTS 8466.30.60 as dividing head/other special attachment for wafer processing machines.
Double-Side Semiconductor Wafer Grinder
Simultaneous double-side grinder that processes both wafer faces concurrently for optimal flatness in semiconductor device fabrication. HTS 8466.30.60 as special attachment for wafer preparation equipment.