Wafer Lapping Plate Holder
Specialized holder that positions semiconductor wafers on lapping machines for flatness control during preparation for fabrication, used with grinders/lappers in heading 8464. HTS 8466.20.80.65 covers this as an other work holder for semiconductor processing equipment. Critical for achieving dimensional tolerances per statistical notes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If part of complete semiconductor wafer processing machine unlisted elsewhere
Unspecified machines for semiconductor fabrication parts go to 8479 basket provision.
If when incorporating measuring gauges for lapping process control
Measuring or checking appliances for flatness fall under Chapter 90.
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Import Tips & Compliance
• Certify surface flatness specs and slurry compatibility; link to specific lapping machine models in 8464; inspect for dual-use potential leading to higher duties
Related Products under HTS 8466.20.80.65
Semiconductor Wafer Chuck
A vacuum or electrostatic chuck designed to securely hold silicon wafers during processing in machines like grinders, polishers, or etchers from headings 8464 or 8465. It is classified under HTS 8466.20.80.65 as a work holder specifically for semiconductor manufacturing equipment used in wafer preparation steps such as grinding and polishing. This accessory ensures precise positioning and minimal contamination during high-precision operations.
Crystal Boule Holder Fixture
A precision fixture that clamps and rotates monocrystalline semiconductor boules during grinding in crystal grinders, part of wafer manufacturing equipment under heading 8464. Classified in HTS 8466.20.80.65 as an other work holder for machines processing semiconductor materials like silicon into wafers. It maintains exact diameter and flat tolerances as per statistical notes.
Wafer Slicing Saw Work Clamp
Adjustable clamp assembly that secures semiconductor wafers or partial boules during slicing operations in wafer slicing saws, compatible with heading 8465 sawing machines. Falls under HTS 8466.20.80.65 as an other work holder essential for precise kerf control in semiconductor wafer preparation. Aligns with statistical notes for equipment slicing wafers from monocrystalline material.
Electrostatic Wafer Stage
Electrostatic stage that grips silicon wafers without physical contact during polishing or grinding in semiconductor equipment under headings 8464-8465. Classified as other work holder in HTS 8466.20.80.65 for principal use in wafer preparation like lapping and polishing. Prevents slip and contamination as noted in statistical definitions.
Boule Alignment Jig
Precision jig for aligning crystal boules prior to grinding flats indicating conductivity type, used with crystal grinders in wafer prep equipment. HTS 8466.20.80.65 as other work holder for heading 8464 machines in semiconductor manufacturing. Matches statistical note (a)(ii)(A) for crystal grinders.
Vacuum Wafer Pick Holder
Vacuum pick-up holder for transferring and holding thin semiconductor wafers between processing stations in grinders and polishers. As a work holder principally for heading 8465 machines, it fits HTS 8466.20.80.65 other category for semiconductor wafer prep.