Wafer Lapping Plate Holder from Japan
Specialized holder that positions semiconductor wafers on lapping machines for flatness control during preparation for fabrication, used with grinders/lappers in heading 8464. HTS 8466.20.80.65 covers this as an other work holder for semiconductor processing equipment. Critical for achieving dimensional tolerances per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify surface flatness specs and slurry compatibility; link to specific lapping machine models in 8464; inspect for dual-use potential leading to higher duties