Wafer Lapping Plate Holder from Germany
Specialized holder that positions semiconductor wafers on lapping machines for flatness control during preparation for fabrication, used with grinders/lappers in heading 8464. HTS 8466.20.80.65 covers this as an other work holder for semiconductor processing equipment. Critical for achieving dimensional tolerances per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Certify surface flatness specs and slurry compatibility; link to specific lapping machine models in 8464; inspect for dual-use potential leading to higher duties