Wafer Lapping Plate Holder from Germany
Specialized holder that positions semiconductor wafers on lapping machines for flatness control during preparation for fabrication, used with grinders/lappers in heading 8464. HTS 8466.20.80.65 covers this as an other work holder for semiconductor processing equipment. Critical for achieving dimensional tolerances per statistical notes.
Duty Rate — Germany → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify surface flatness specs and slurry compatibility; link to specific lapping machine models in 8464; inspect for dual-use potential leading to higher duties