Quartz Wafer Lapping Machine

Double-sided lapping machine for achieving flatness tolerances on quartz crystal wafers used in oscillators. As quartz is stone, grinding/lapping falls under HTS 8464.20.01 for stone working.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2%+35.0%37%
🇲🇽Mexico2%+10.0%12%
🇨🇦Canada2%+10.0%12%
🇩🇪Germany2%+10.0%12%
🇯🇵Japan2%+10.0%12%

More Specific Codes

This product may fall under a more specific subheading:

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.10.00Lower: 25% vs 37%

If silicon wafer processing version

Semiconductor wafer prep equipment specifically excludes stone under statistical notes to Chapter 84.

7103.10.20Lower: 17.5% vs 37%

If for gemstone polishing

Quartz grinders for jewelry grade material classify under precious stones.

9027.50Lower: 10% vs 37%

If integrated with wafer testing

Lappers with optical testing functions shift to Chapter 90 instruments.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Specify lambda/10 flatness capability and slurry type for quartz in technical specs

CBP often requires end-user statements for electronics vs. gemstone applications

Ensure cleanroom compatibility documentation if claimed