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8464.20.01/Quartz Wafer Lapping Machine/Japan

Quartz Wafer Lapping Machine from Japan

Double-sided lapping machine for achieving flatness tolerances on quartz crystal wafers used in oscillators. As quartz is stone, grinding/lapping falls under HTS 8464.20.01 for stone working.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify lambda/10 flatness capability and slurry type for quartz in technical specs

• CBP often requires end-user statements for electronics vs. gemstone applications

• Ensure cleanroom compatibility documentation if claimed

Quartz Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8464.20.01