Quartz Wafer Lapping Machine from Japan
Double-sided lapping machine for achieving flatness tolerances on quartz crystal wafers used in oscillators. As quartz is stone, grinding/lapping falls under HTS 8464.20.01 for stone working.
Duty Rate — Japan → United States
12%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify lambda/10 flatness capability and slurry type for quartz in technical specs
• CBP often requires end-user statements for electronics vs. gemstone applications
• Ensure cleanroom compatibility documentation if claimed