Quartz Wafer Lapping Machine from Japan
Double-sided lapping machine for achieving flatness tolerances on quartz crystal wafers used in oscillators. As quartz is stone, grinding/lapping falls under HTS 8464.20.01 for stone working.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify lambda/10 flatness capability and slurry type for quartz in technical specs
• CBP often requires end-user statements for electronics vs. gemstone applications
• Ensure cleanroom compatibility documentation if claimed