Other
Machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold working glass: > Grinding or polishing machines > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8464.20.01.20
Crystal Boule Grinder
Precision grinding machine used to grind semiconductor crystal boules to exact diameters and flats indicating conductivity type and resistivity, as per statistical notes for wafer manufacturing equipment. Classified under HTS 8464.20.0120 as a grinding machine for mineral materials like silicon crystals. Essential for preparing monocrystalline boules before wafer slicing in semiconductor production.
Silicon Wafer Lapping Machine
Lapping equipment for semiconductor wafers that achieves ultra-flat surfaces within tight dimensional tolerances before fabrication, covered under statistical note (a)(ii)(C) for wafer preparation. HTS 8464.20.0120 applies as a grinding/polishing machine for mineral semiconductor materials. Critical for ensuring wafer flatness in chip production.
Gallium Arsenide Wafer Polisher
Polishing machine for compound semiconductor wafers like gallium arsenide, bringing surfaces to mirror finish required for device fabrication per statistical note (a)(ii)(C). Fits HTS 8464.20.0120 for polishing machines working like mineral materials. Used after lapping to prepare wafers for photolithography.
Ceramic Substrate Grinder
Grinding machine for alumina or aluminum nitride ceramic substrates used in power electronics and LED packaging. HTS 8464.20.0120 covers grinding machines for ceramics, a like mineral material. Ensures substrate flatness for reliable die attach in semiconductor modules.
Sapphire Wafer Grinder
Precision grinder for synthetic sapphire wafers used in LED epitaxy and RF devices, grinding to optical tolerances. Classified under HTS 8464.20.0120 for grinding machines working hard mineral materials like corundum (sapphire). Prepares substrates for epitaxial growth in optoelectronics.
Silicon Carbide Wafer Lapper
Lapping machine for SiC wafers used in power semiconductors, achieving sub-micron flatness for epitaxial growth. HTS 8464.20.0120 for grinding/polishing silicon carbide, a ceramic mineral material. Essential for high-voltage power device manufacturing.
Glass Lens Grinding Machine for Fiber Optics
Cold working grinder for precision glass lenses used in semiconductor fiber optic transceivers. Fits HTS 8464.20.0120 for glass cold working grinding machines. Produces microlenses for VCSEL coupling in data center optics.
Concrete Wafer Polishing Machine
High-precision polisher for engineered concrete wafer substrates in advanced power modules. HTS 8464.20.0120 covers concrete polishing machines. Alternative mineral substrate for SiC power semiconductors.
Czochralski Crystal Grinder
Grinder specifically for Czochralski-grown silicon boules, per statistical note (a)(i) methods. HTS 8464.20.0120 for mineral crystal grinding. Prepares ingots for wafer production in CZ process.