Crystal Boule Grinder
Precision grinding machine used to grind semiconductor crystal boules to exact diameters and flats indicating conductivity type and resistivity, as per statistical notes for wafer manufacturing equipment. Classified under HTS 8464.20.0120 as a grinding machine for mineral materials like silicon crystals. Essential for preparing monocrystalline boules before wafer slicing in semiconductor production.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If specifically for semiconductor wafer manufacturing
Dedicated semiconductor manufacturing machines fall under 8486.40 per Chapter 84 notes, shifting from general mineral grinding tools.
If primarily for precision metrology or testing
Measuring/testing instruments for semiconductor materials are in Chapter 90, not machine tools for material working.
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Import Tips & Compliance
• Verify machine specifications match statistical note (a)(ii)(A) for crystal grinders to avoid reclassification; provide detailed technical documentation on boule processing capability; ensure EPCG or duty drawback eligibility for semiconductor equipment
Related Products under HTS 8464.20.01.20
Silicon Wafer Lapping Machine
Lapping equipment for semiconductor wafers that achieves ultra-flat surfaces within tight dimensional tolerances before fabrication, covered under statistical note (a)(ii)(C) for wafer preparation. HTS 8464.20.0120 applies as a grinding/polishing machine for mineral semiconductor materials. Critical for ensuring wafer flatness in chip production.
Gallium Arsenide Wafer Polisher
Polishing machine for compound semiconductor wafers like gallium arsenide, bringing surfaces to mirror finish required for device fabrication per statistical note (a)(ii)(C). Fits HTS 8464.20.0120 for polishing machines working like mineral materials. Used after lapping to prepare wafers for photolithography.
Ceramic Substrate Grinder
Grinding machine for alumina or aluminum nitride ceramic substrates used in power electronics and LED packaging. HTS 8464.20.0120 covers grinding machines for ceramics, a like mineral material. Ensures substrate flatness for reliable die attach in semiconductor modules.
Sapphire Wafer Grinder
Precision grinder for synthetic sapphire wafers used in LED epitaxy and RF devices, grinding to optical tolerances. Classified under HTS 8464.20.0120 for grinding machines working hard mineral materials like corundum (sapphire). Prepares substrates for epitaxial growth in optoelectronics.
Silicon Carbide Wafer Lapper
Lapping machine for SiC wafers used in power semiconductors, achieving sub-micron flatness for epitaxial growth. HTS 8464.20.0120 for grinding/polishing silicon carbide, a ceramic mineral material. Essential for high-voltage power device manufacturing.
Glass Lens Grinding Machine for Fiber Optics
Cold working grinder for precision glass lenses used in semiconductor fiber optic transceivers. Fits HTS 8464.20.0120 for glass cold working grinding machines. Produces microlenses for VCSEL coupling in data center optics.