Crystal Boule Grinder from China
Precision grinding machine used to grind semiconductor crystal boules to exact diameters and flats indicating conductivity type and resistivity, as per statistical notes for wafer manufacturing equipment. Classified under HTS 8464.20.0120 as a grinding machine for mineral materials like silicon crystals. Essential for preparing monocrystalline boules before wafer slicing in semiconductor production.
Duty Rate — China → United States
37%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify machine specifications match statistical note (a)(ii)(A) for crystal grinders to avoid reclassification; provide detailed technical documentation on boule processing capability; ensure EPCG or duty drawback eligibility for semiconductor equipment