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8461.50.80/Crystal Boule Grinder/Japan

Crystal Boule Grinder from Japan

Machine tool for grinding semiconductor crystal boules to precise diameters and flats indicating conductivity type, essential wafer preparation step. HTS 8461.50.80 covers this as other sawing/cutting-off equipment for semiconductor material processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify flat orientation tolerances (±0.5°) and diameter uniformity in technical data sheets

• Include crystal resistivity measurement correlation for classification support