Crystal Boule Grinder from Japan
Machine tool for grinding semiconductor crystal boules to precise diameters and flats indicating conductivity type, essential wafer preparation step. HTS 8461.50.80 covers this as other sawing/cutting-off equipment for semiconductor material processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify flat orientation tolerances (±0.5°) and diameter uniformity in technical data sheets
• Include crystal resistivity measurement correlation for classification support