Other
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Sawing or cutting-off machines: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Subheadings
Products classified under HTS 8461.50.80
Gallium Arsenide Wafer Saw
Specialized inner-diameter saw optimized for brittle GaAs compound semiconductor wafers, minimizing subsurface damage. HTS 8461.50.80 includes sawing machines for non-silicon semiconductor materials per statistical notes.
Czochralski Crystal Puller
A machine tool used in semiconductor manufacturing to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon using the Czochralski method. It removes excess material through precise cutting and grinding processes to achieve required dimensions, classified under HTS 8461.50.80 as a sawing or cutting-off machine for semiconductor wafer production.
Float Zone Crystal Grower
Specialized sawing and cutting machine employing float zone method to produce high-purity silicon crystals for wafers, involving precise zone melting and cutting-off operations. Falls under HTS 8461.50.80 for semiconductor-specific cutting-off machines working by removing cermets or similar materials.
Semiconductor Wafer Slicing Saw
High-precision diamond wire saw for slicing ultra-thin wafers from monocrystalline silicon boules in semiconductor fabrication. Classified in HTS 8461.50.80 as a sawing machine specifically for cutting-off semiconductor material to wafer thickness tolerances.
Crystal Boule Grinder
Machine tool for grinding semiconductor crystal boules to precise diameters and flats indicating conductivity type, essential wafer preparation step. HTS 8461.50.80 covers this as other sawing/cutting-off equipment for semiconductor material processing.
Wafer Edge Profiling Machine
Precision cutting-off machine that profiles wafer edges to prevent chipping during handling in semiconductor fabs. Classified under HTS 8461.50.80 for specialized semiconductor wafer preparation sawing equipment.
Silicon Ingot Notching Machine
Automated cutting machine that creates orientation flats on silicon ingots for wafer alignment in semiconductor processing. Falls under HTS 8461.50.80 as specialized cutting-off equipment for semiconductor boule preparation.
Diamond Wire Wafer Slicer
Advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of semiconductor wafers from a single boule. HTS 8461.50.80 covers this high-precision sawing technology for semiconductor wafer manufacturing.