Crystal Boule Grinder
Machine tool for grinding semiconductor crystal boules to precise diameters and flats indicating conductivity type, essential wafer preparation step. HTS 8461.50.80 covers this as other sawing/cutting-off equipment for semiconductor material processing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.4% | +35.0% | 39.4% |
| 🇲🇽Mexico | 4.4% | +10.0% | 14.4% |
| 🇨🇦Canada | 4.4% | +10.0% | 14.4% |
| 🇩🇪Germany | 4.4% | +10.0% | 14.4% |
| 🇯🇵Japan | 4.4% | +10.0% | 14.4% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general metallurgical sample preparation
Non-semiconductor crystal grinding falls under other grinding/sanding machines.
If part of integrated boule processing line
When functioning within complete semiconductor apparatus, reclassifies to 8486.
Not sure which classification is right?
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Import Tips & Compliance
• Specify flat orientation tolerances (±0.5°) and diameter uniformity in technical data sheets
• Include crystal resistivity measurement correlation for classification support
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