Semiconductor Crystal Polisher
Final polishers bringing boule/wafer surfaces to mirror finish (Ra < 0.5 nm) for device fabrication. HTS 8461.50.80.90 as other finishing machines removing cermets in statistical semiconductor processing.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If integrated CMP equipment
Chemical-mechanical polishers as semiconductor machines.
If medical/optical polishing
Similar tech but different end-use chapters.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide surface roughness certification traceable to NIST
• EPA declarations for chemical-mechanical polishing slurries
Related Products under HTS 8461.50.80.90
Gallium Arsenide Wafer Saw
Precision cutting-off saw optimized for brittle GaAs boules into compound semiconductor wafers with minimal chipping. HTS 8461.50.80.90 covers sawing machines for cermet removal in statistical note materials.
Czochralski Crystal Puller
A machine tool that uses the Czochralski method to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon, grinding the boule to precise diameter. Classified under HTS 8461.50.80.90 as a sawing or cutting-off machine tool working by removing metal or cermets for semiconductor crystal preparation.
Float Zone Crystal Grower
Machine employing float zone method to produce pure monocrystalline semiconductor boules, with integrated grinding for flats indicating conductivity and resistivity. Falls under HTS 8461.50.80.90 as other sawing/cutting-off machine tools removing metal or cermets in semiconductor processing.
Crystal Boule Grinder
Precision grinder for semiconductor crystal boules, achieving exact diameter and flats for conductivity/resistivity indication before wafer slicing. HTS 8461.50.80.90 covers this as other machine tools for sawing/cutting-off by removing metal or cermets in wafer prep.
Semiconductor Wafer Slicing Saw
Diamond wire saw for slicing ultra-thin wafers from monocrystalline semiconductor boules like silicon or gallium arsenide. Classified in HTS 8461.50.80.90 as other sawing or cutting-off machines removing cermets in semiconductor manufacturing.
Wafer Edge Grinder
Machine for grinding wafer edges post-slicing to precise tolerances and remove damage layers before polishing. HTS 8461.50.80.90 includes this semiconductor wafer preparation tool as other cutting-off/grinding by metal/cermet removal.