Semiconductor Crystal Polisher from Japan
Final polishers bringing boule/wafer surfaces to mirror finish (Ra < 0.5 nm) for device fabrication. HTS 8461.50.80.90 as other finishing machines removing cermets in statistical semiconductor processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide surface roughness certification traceable to NIST
• EPA declarations for chemical-mechanical polishing slurries