CNC Wafer Edge Profiling Slotter
Numerically controlled slotting machine adapted for semiconductor wafer edge profiling and flat grinding. HTS 8461.20.40.00 applies despite semiconductor use, as primary function is metal/cermet removal shaping.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.4% | +35.0% | 39.4% |
| 🇲🇽Mexico | 4.4% | +10.0% | 14.4% |
| 🇨🇦Canada | 4.4% | +10.0% | 14.4% |
| 🇩🇪Germany | 4.4% | +10.0% | 14.4% |
| 🇯🇵Japan | 4.4% | +10.0% | 14.4% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If specifically for semiconductor wafer processing per statistical notes
Semiconductor manufacturing machines have dedicated provisions outside standard machine tool chapters.
If when used for wafer metrology/testing
Testing apparatus for semiconductor devices classifies in Chapter 90.
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Import Tips & Compliance
• Include semiconductor fab end-user letters to justify specialized classification
• Reference statistical notes but classify based on machine tool function, not end use
• Dual-use documentation prevents reclassification to Chapter 90 testing equipment
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CNC Horizontal Shaping Machine
A numerically controlled machine tool designed for shaping metal workpieces by linear reciprocating motion of a single-point cutting tool. It falls under HTS 8461.20.40.00 as a shaping machine that removes metal through precise CNC-controlled movements for high-accuracy industrial applications.
CNC Vertical Slotting Machine
Numerically controlled slotting machine that uses a ram-driven tool for cutting keyways, slots, and internal splines in metal parts. Classified under HTS 8461.20.40.00 for its slotting operation removing metal or cermets via CNC precision.
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