8461.20.40.00/CNC Wafer Edge Profiling Slotter/Japan

CNC Wafer Edge Profiling Slotter from Japan

Numerically controlled slotting machine adapted for semiconductor wafer edge profiling and flat grinding. HTS 8461.20.40.00 applies despite semiconductor use, as primary function is metal/cermet removal shaping.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include semiconductor fab end-user letters to justify specialized classification

• Reference statistical notes but classify based on machine tool function, not end use

• Dual-use documentation prevents reclassification to Chapter 90 testing equipment