CNC Silicon Wafer Polishing Tool from China
Numerically controlled polishing machine employing abrasive slurries to finish silicon wafer surfaces to nanometer-level flatness for semiconductor device fabrication. Classified in HTS 8460.90.4060 due to its grinding/polishing function on metal surfaces using abrasives in a CNC configuration. Critical for removing defects post-lapping in wafer preparation.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide slurry compatibility and polishing pad specifications to demonstrate abrasive finishing capability
• Obtain ISO cleanroom certifications to support classification and avoid general polishing machine pitfalls
• Declare exact numerical control software version for customs verification