CNC Silicon Wafer Polishing Tool from Canada
Numerically controlled polishing machine employing abrasive slurries to finish silicon wafer surfaces to nanometer-level flatness for semiconductor device fabrication. Classified in HTS 8460.90.4060 due to its grinding/polishing function on metal surfaces using abrasives in a CNC configuration. Critical for removing defects post-lapping in wafer preparation.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide slurry compatibility and polishing pad specifications to demonstrate abrasive finishing capability
• Obtain ISO cleanroom certifications to support classification and avoid general polishing machine pitfalls
• Declare exact numerical control software version for customs verification