Manual Crystal Wafer Grinder
Hand-operated grinder for processing semiconductor crystal boules to precise diameters, creating flats for conductivity indication as per statistical notes. Classified under HTS 8460.40.80.20 for grinding machines finishing metal/cermets, low-value. Essential in wafer preparation workflow.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If numerically controlled (CNC)
CNC honing/lapping/grinding machines have separate provisions from manual 'other' machines.
If for integrated testing and grinding apparatus
Hybrid test-processing equipment for semiconductors goes to Chapter 90 per notes.
If classified as semiconductor manufacturing machine not specifically grinding
Broader semiconductor machines without precise grinding function may fall under 8479.
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Import Tips & Compliance
• Document crystal grinding function with photos/specs; distinguish from general metal grinders
• Ensure valuation excludes software or accessories to stay under $3,025 threshold
• Obtain manufacturer's declaration linking to semiconductor statistical note (a)(ii)(A)
Related Products under HTS 8460.40.80.20
Benchtop Wafer Lapping Machine
A compact machine designed for precision lapping of semiconductor wafers to achieve exact flatness tolerances prior to fabrication processes. It falls under HTS 8460.40.80.20 as a lapping machine for finishing metal or cermets (silicon wafers qualify as cermet-like materials in semiconductor context), valued under $3,025 each. Used in wafer preparation equipment per statistical notes.
Portable Semiconductor Wafer Polisher
Lightweight polisher for final surface finishing of silicon wafers, achieving mirror-like flatness for device fabrication. HTS 8460.40.80.20 applies to low-value polishing machines using abrasives on cermet-like semiconductor materials. Aligns with statistical note for wafer grinders, lappers, polishers.
Tabletop Honing Machine for Cermet Parts
Small honing machine for finishing cermet components used in semiconductor processing tools, using abrasive stones. Fits HTS 8460.40.80.20 as other low-value honing machines for metal/cermets. Supports precision finishing in high-tech manufacturing.
Entry-Level Wafer Edge Grinder
Budget grinder for chamfering and edge finishing of semiconductor wafers to prevent chipping during handling. Under HTS 8460.40.80.20 for low-value grinding machines finishing silicon (cermet equivalent). Part of wafer preparation per statistical notes.
Compact Lapping Plate Polisher
Machine with lapping plates for simultaneous polishing of multiple small semiconductor wafers or cermet substrates. HTS 8460.40.80.20 for low-value lapping/polishing equipment using abrasives on metals/cermets.
Mini Bore Honing Tool for Wafer Fixtures
Precision honing machine for small bores in metal fixtures holding semiconductor wafers during processing. Low-value under HTS 8460.40.80.20 as other honing machines.